JPH0337859B2 - - Google Patents

Info

Publication number
JPH0337859B2
JPH0337859B2 JP60263276A JP26327685A JPH0337859B2 JP H0337859 B2 JPH0337859 B2 JP H0337859B2 JP 60263276 A JP60263276 A JP 60263276A JP 26327685 A JP26327685 A JP 26327685A JP H0337859 B2 JPH0337859 B2 JP H0337859B2
Authority
JP
Japan
Prior art keywords
capillary
wire bonding
tip
silicon carbide
ruby
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60263276A
Other languages
English (en)
Japanese (ja)
Other versions
JPS62123729A (ja
Inventor
Isao Kishimoto
Hiroyuki Miura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Priority to JP60263276A priority Critical patent/JPS62123729A/ja
Publication of JPS62123729A publication Critical patent/JPS62123729A/ja
Publication of JPH0337859B2 publication Critical patent/JPH0337859B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H01L2224/78302—Shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP60263276A 1985-11-22 1985-11-22 ワイヤボンデイング用キヤピラリ− Granted JPS62123729A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60263276A JPS62123729A (ja) 1985-11-22 1985-11-22 ワイヤボンデイング用キヤピラリ−

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60263276A JPS62123729A (ja) 1985-11-22 1985-11-22 ワイヤボンデイング用キヤピラリ−

Publications (2)

Publication Number Publication Date
JPS62123729A JPS62123729A (ja) 1987-06-05
JPH0337859B2 true JPH0337859B2 (en]) 1991-06-06

Family

ID=17387211

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60263276A Granted JPS62123729A (ja) 1985-11-22 1985-11-22 ワイヤボンデイング用キヤピラリ−

Country Status (1)

Country Link
JP (1) JPS62123729A (en])

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI865802B (zh) * 2020-08-20 2024-12-11 美商工藝技術公司 引線接合毛細管

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61204946A (ja) * 1985-03-07 1986-09-11 Mitsubishi Electric Corp ワイヤボンディング用キャピラリチップの製造方法

Also Published As

Publication number Publication date
JPS62123729A (ja) 1987-06-05

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees